Advances in Electronic Circuit Packaging: Volume 5 by George R. Dallimore (auth.), Lawrence L. Rosine (eds.)

By George R. Dallimore (auth.), Lawrence L. Rosine (eds.)

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Read Online or Download Advances in Electronic Circuit Packaging: Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19–2 PDF

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Additional resources for Advances in Electronic Circuit Packaging: Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19–2

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The panel is masked, and the conformal coating is applied by pouring the silicone ruhher on all exposed surfaces and allowing it to eure. The free volume of the unit is then filled with phenolic microballoons through the access hole in the shield which is in a plane parallel to the board. Some rocking action of the unit is used to aid in filling, especially as the filling action nears completion. The sealing surfaces are coated with synthetic rubber, and the panel assembly is installed in the housing.

5) was used to test this encapsulating system. The volume encapsulated is about 7 x 10 x 4 in. The unit contains about 200 components in fourteen cordwood modules plus another 200 Iaydown components. These are soldered to a 7 x 10 in. epoxy glass printed circuit board. The board shown in Fig. 6 is mounted F ig. 6. The 7 x 10 in . printed circuit board mo unted a nd coated . 26 E. C. -long studs around the periphery of the board. The four corner studs, together with a flange on the panel, also support a meta) shield.

54 R. E. Klein and J. Garnmon Fig. 12. Example of module assembly. Maintenance Considerations Replacing a module in a system can be accomplished in a minimum of time. In the example of assembly shown in Figs. II and 12, it is only necessary to remove the two loading rails, which bear against the ends of the heat sinks, to make the modules accessible. Any of the modules can then be pushed out from the rear, without disturbing the others. Also, with the flexible wiring used for interconnection, it is very simple to make a11 of the connections to the modules available as test points.

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Advances in Electronic Circuit Packaging: Volume 5 by George R. Dallimore (auth.), Lawrence L. Rosine (eds.)
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