By D. A. Beck (auth.), Gerald A. Walker (eds.)
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Additional info for Advances in Electronic Circuit Packaging: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado
Test setup for measuring response of circuit boards. - ~ " 0 --- UNDAMPED 0 o 2 -~. 1-, ,DAMPED 3 PLY I 4 6 VIBRATORY INPur G's 8 10 Fig. 11. Response of 4 in. by 4 in. 062 glass epoxy cirCuit board, fixed at 4 corners. -- -- ~~ UNDAMPED~ 2 CDAMPJ:i:D 3 PLY I 6 4 VIBRATORY INPur G's 8 Fig. 12. Response of 5 in. by 5 in. 093 glass epoxy circuit board, fixed at 4 corners. 10 30 0 UNDAMPED - ~ ~ 0 11\ ~ ......... -- -- R. P. Thorn r-- - rDAMPED 3 PLY 1o 4 6 VIBRATORY INPur G'S 2 Fig. 13. Response of 6 in.
1 Formulation - The encapsulating compound shall be formulated from the materials listed below, taken in their exact weights. The tolerance on weights of materials shall be ± 1%. 1. 1 Master Batches - Master batches of filled epoxy resin may be prepared by combining 70 parts, by weight, of epoxy resin with 30 parts of filler. The final formulation· shall then be prepared by combining 1000 g of this mix with 85 gof hardener. 1. 2 Filler Material - Since the filler material tends to segregate and stratify in its shipping container during shipping and handling, it shall be blended, but not sieved or screened, before use to ensure a uniform particle distribution throughout the material.
0 Temp. /hr/ftz/oF Specific gravity ASTM 0792 Heat distortion temp. 264 psi ASTM 0648 Heat resistance, wt. loss. % MlL-I-16923 Moisture absorption. wt. 55 430 Room temp. 68'10 8 T ABLE III. Comparative Properties of Potting Compounds of Various Density Density. Ib/ft 3 Tensile strength. psi Tensile modulus. x 10 6 psi Compressive strength, psi Compressive modulus. x 10 5 psi Flexural strength. psi Flexural modulus. 300 12 *Average properties for several types of 10 Ib/ft 3 foam, (the density most commonly used by Sandia).
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